Electronic manufacturing yield enhancement for semiconductor process & packaging, and card assembly process (BGA/SMT/PIH).   Design Experiments to measure reliability (also Bellcore, MIL-HDBK) & quality (including supplier auditing).  Failure Analyst skilled with oil, water, emission,& infrared microscopy, x-ray, voltage contrast, wet/dry chemistry, microsectioning (FIB & polishing), SEM/EDX.